相变热沉结构瞬态仿真计算

Transient Simulation Calculation of Phase Change Heat Sink Structure

弹载电子设备体积小、重量轻、热耗高,且与外界绝热,散热问题是一大难题。利用弹载电子设备短时间工作和相变材料高潜热的特性,进行相变材料散热结构一体化设计,优化传热路径,通过相变储能解决弹载电子设备短时间工作散热问题。为了评估相变材料结构作为热沉的散热效果和热设计符合性,提出一种相变过程等效比热容的瞬态仿真计算方法,并通过试验测试验证仿真结果,对比仿真计算与试验测试结果,两者最大相差2.5℃,为2.47%。试验结果表明仿真计算结果准确,相变材料等效比热容计算方法可行,为电子设备相变热沉散热结构瞬态仿真提供了新思路、新方法。

The electronic equipment on missile is small in size,light in weight,high in heat consumption,and adiabatic with the outside,so the problem of heat dissipation is a big problem.The integrated design of heat dissipation structure and heat transfer path optimization of phase-change materials were carried out based on the characteristics of the short-time working of the electronic equipment on missile and the high latent heat of phase-change materials,and the problem of heat dissipation of the electronic equipment on missile was solved by phase-change energy storage.In order to evaluate the heat dissipation effect and thermal design compliance of phase change materials structures as heat sinks,a transient simulation method was proposed to calculate the equivalent specific heat capacity of the phase change process.The simulation results were verified by experimental tests.The maximum difference between the simulation results and the experimental results was 2.47%,which was 2.5℃.The experimental results show that the simulation results are accurate and the calculation method of equivalent specific heat capacity of phase-change materials is feasible,which provides a new idea and method for the transient simulation of phase-change heat sink structure of electronic equipment.