镀金工艺的研究进展

Research Progress of Gold Plating

本文重点介绍了氰化物镀金、无氰镀金工艺,综述了每种镀金工艺的基本组成、镀金工艺参数等因素对镀层和镀液体系性能的影响。在无氰脉冲电镀金铜合金工艺中,镀层含有铜、金元素;镀层表面无裂纹,平整性好,孔隙率低,细致均匀;镀层耐蚀性强,结合力好,硬度高;镀液稳定性好,电流效率高。对相关镀液体系中金的电沉积行为进行了总结,并对未来无氰电镀金工艺的发展方向进行了展望。

In this paper,the cyanide gold plating and non-cyanide gold plating technologies were comprehensively studied.The effects of composition and gold plating process parameters of each process on the properties of plating and electrolyte system were summarized.The electrodeposition behavior of gold in related bath was also discussed and the development trend of non-cyanide gold plating technology was prospected.There are only Au and Cu element in the coating,and the coating has fine and uniform grains,low porosity,good smoothness and free of cracks,with high hardness,excellent adhesion,and corrosion resistance.The plating bath has high current efficiency and good stability.