添加合金元素对锡基电子材料电化学迁移影响的研究进展

Research Progress on the Effect of Addition of Alloy Elements on Electrochemical Migration of Tin-Based Electronic Materials

锡基电子材料是电子元器件封装及焊接的核心材料之一,针对锡基电子材料服役过程中存在的电化学迁移失效问题,讨论了锡基电子材料的主要失效形式、电化学迁移的机理、研究方法、评价方法以及抑制方法,综述了掺杂不同合金元素对锡基电子材料电化学迁移行为的影响规律。

Tin-based electronic materials are one of the core materials for electronic component packaging and welding.Aiming at the electrochemical migration failure of tin-based electronic materials in service,the main failure forms,electrochemical migration mechanism,research methods,evaluation methods and inhibition methods of tin-based electronic materials were discussed in this paper.Meanwhile,the effects of different alloying elements on the electrochemical migration behavior of tin-based electronic materials were reviewed.