电子封装陶瓷的研究进展

Research Progress in Electronic Packaging Ceramics

随着电子信息技术的发展,电子元器件逐渐向小型化、高度集成化、多功能化、低成本等方向迅猛发展,这对于电子封装陶瓷材料的性能和工艺也提出了更高的要求。介绍了电子封装陶瓷的材料和工艺技术,重点概述低温共烧陶瓷(LTCC)的工艺技术;论述了当前电子封装陶瓷组分的研究概况,主要包括以氧化铝基陶瓷为例的研究进展、粉体颗粒对烧结工艺的影响及陶瓷表面金属化的研究进展。概述了电子封装陶瓷的实际应用,并对其在未来的发展前景进行了展望。

With the development of electronic information technology,electronic components are being gradually developed in the direction of miniaturization,high integration,multi-function,low cost,etc.Therefore,higher requirements are put forward for the performance and process of electronic packaging ceramic materials.It was aimed to introduce research progress in electronic packaging ceramic materials and technology,by focusing on low temperature co-firing ceramic(LTCC)technology.Specifically,electronic packaging ceramic components(such as alumina-based ceramics)will be presented,with topics like influence of particles on sintering process and ceramic surface metallization.Practical application of electronic packaging ceramics are discussed and the future development and prospect are prospected.