陶瓷柱栅阵列封装器件回流焊工艺仿真

Simulation of Reflow Soldering Process for Ceramic Column Grid Array Packaged Devices

陶瓷柱栅阵列(Ceramic Column Grid Array,CCGA)封装器件因具有高密度输入/输出、高可靠性、优良的电气和热性能等优点,被广泛应用于航空航天领域。通过微线圈型CCGA封装器件的回流焊工艺仿真,分析了降温速率和印制电路板(Printed Circuit Board, PCB)焊盘直径对焊接残余应力的影响,并通过参数优化选取较优的工艺参数组合。结果表明,降温速率在1~2.5℃/s内变化时,最大残余应力变化不明显,降温速率大于2.5℃/s时,降温速率越大,残余应力越大;PCB焊盘直径对焊接残余应力的影响未呈现出规律性的趋势,当PCB焊盘直径为0.76 mm时,残余应力最小,为10.7490 MPa;通过参数优化可知,当PCB焊盘直径为0.76 mm、降温速率为2.0℃/s时,残余应力最小,为6.9600 MPa。

Ceramic column grid array(CCGA) packaging device is widely used in aerospace field because of its high density input/output, high reliability, excellent electrical and thermal performance. Through the simulation of reflow soldering process of micro coil CCGA packaging device, the effects of cooling rate and pad diameter of printed circuit board(PCB) on welding residual stress are analyzed, and the optimal combination of process parameters is selected through parameter optimization. The results show that the greater the cooling rate is, the greater the residual stress is. However, when the cooling rate changes within 1-2.5 ℃/s, the change of the maximum residual stress is not obvious. When the diameter of PCB pad is 0.76 mm, the minimum residual stress is 10.7490 MPa. Through the parameter optimization, when the pad diameter is 0.76 mm and the cooling rate is 2.50 ℃/s, the residual stress is the minimum of 6.9600 MPa.