高频高速通信覆铜板信号损失分析及研究进展

Analysis and Research Progresson Signal Loss of High Frequency and High Speed Communication Copper CladLaminate

随着5G通信信号频率的不断提高,作为各类集成电路的基板,覆铜板(Copper Clad Laminate,CCL)在高频通信条件下对传输信号损失的影响比低频通信条件下大幅提高,5G高频高速通信对信号质量的要求也更加严格。研究在高频下CCL导致的各种信号损失成因及其控制措施具有较大的应用价值。分析了高频高速CCL导致信号损失的主要途径,概括了近年来高频CCL信号损失控制技术领域的研究进展,重点从导体损耗、介质损耗、辐射损耗等方面入手,分析了影响损耗的主要参数,给出了降低信号损失的可行方案。

The frequency of 5 G communication signals is constantly improving, and as the substrate of all kinds of integrated circuits, the influence of copper clad laminate(CCL) on transmission signal loss is greater under the condition of high frequency communication than that under the condition of low frequency communication.5 G high frequency and high speed communication also has more stringent requirements for signal quality. It has great application value to study the causes and control measures of various signal loss caused by CCL at high frequency. To the main way of the signal loss, the signal loss of transmission signal under high frequency and high speed for CCL is analyzed. The loss control technologies are surveyed on the signal transmission of high frequency copper clad laminates in recent years. The research progress mainly focuses on conductor loss,dielectric loss, and other aspects of radiation loss. The main parameters affecting the loss are analyzed, and the feasible scheme of lower signal loss is given.