双重固化体系在电子材料中的应用

Application of the Dual-curing System in Electronic Materials

光固化技术具有固化速度快、绿色环境友好等优点,但同时也有一些自身无法避免的缺陷,例如光照不充分的区域固化效果差,耐高温性能、耐强化学腐蚀性相对较差等。为了克服这些缺陷,可以将热固化、潮气固化作为光固化的补充方式,设计成“光固化–热固化”或“光固化–潮气固化”的双重固化体系,进而有效弥补光固化的缺陷。以液态感光阻焊涂层和线路板三防涂料为例,论述了双重固化体系的技术优势及在电子材料中的应用。

UV curing technology has some advantages such as high curing speed,green and environmental friendliness.Meanwhile,there are a few unavoidable drawbacks as well:the curing effect is poor in areas that do not get enough UV light;the high temperature resistance and chemical corrosion resistance are relatively poor.To overcome these defects,thermal curing and moisture curing can be used as supplements to UV curing and designed as“UV curing-thermal curing”or“UV curing-moisture curing”dual-curing system to effectively compensate for the defects of UV curing.This paper with the liquid photo-imageable solder mask(LPSM)and conformal coatings as examples explains the technological advantages of the dual-curing system and its applications in electronic materials.