柔性电子用石墨烯/铜纳米片复合材料的制备与性能研究

Study on Preparation and Properties of Graphene/Copper Nanocomposites for Flexible Electronics

采用液相沉淀结合气相热还原法制备了石墨烯/铜纳米片复合材料。表征了氧化石墨烯/氧化铜前驱体和石墨烯/铜纳米片复合材料的微观形貌、成分,研究了前驱体中氧化铜纳米片的形貌控制规律和热还原工艺对石墨烯/铜纳米片复合材料形貌、成分、导电性的影响。结果表明,选用氯化铜作为铜源可以得到片径较大的氧化铜纳米片,气相热还原温度在180℃左右时即可使氧化石墨烯/氧化铜纳米片前驱体还原为石墨烯/铜,同时铜纳米片可保持为较好的片状形貌。石墨烯/铜纳米片复合材料具有较好的导电性,可以作为柔性印刷电子用导电填料。

Graphene/copper nanocomposites were prepared by liquid-phase precipitation and gas-phase thermal reduction.The morphology and composition of graphene oxide/copper oxide precursor and graphene/copper nanosheet composites were characterized.The morphology control law of copper oxide nanosheet in precursor and the effect of thermal reduction process on the morphology,composition and conductivity of graphene/copper nanosheet composites were studied.The results show that copper oxide nanosheets with larger size can be obtained by using copper chloride as copper source.The precursor of graphene oxide/copper oxide nanosheets can be reduced to graphene/copper when the temperature of gas phase thermal reduction is about 180℃,and the copper nanosheets can maintain a good sheet shape.Graphene/copper nanocomposites have good conductivity and can be used as conductive fillers for flexible printed electronics.