新型硅基3D异构集成毫米波AiP相控阵列

A Novel Millimeter-wave Phased-array Antenna-in-package Based on Silicon 3D Heterogeneous Technology

基于硅基3D异构集成工艺,提出了一种低剖面、轻质化2×2硅基毫米波AiP阵列,内部集成了微带贴片天线阵列、单通道Ga As收发放大芯片、四通道SiGe幅相多功能芯片和电源调制电路等。采用硅片与低介电常数材料相结合的方式,降低天线衬底的复合介电常数,提升辐射效率和增益。通过高深宽比TSV和高密度微凸点,实现微波信号、数字信号和电源的垂直传输,对外采用标准的BGA端口。测试结果表明:在34~36 GHz内,2×2硅基AiP的等效全向辐射功率大于31.5 dBm,接收增益大于22 dB,射频输入口回波损耗小于-13 dB,具有5位移相、5位衰减功能,外形尺寸为12.0 mm×14.0 mm×2.6 mm,重量仅为0.75 g,可实现±30°的波束扫描。

Based on silicon three-dimension heterogeneous integration process,a low profile and lightweight 2×2 silicon-based millimeter-wave antenna-in-package(AiP)array was presented,which included micro-strip patch antennas,four GaAs transmit-receive amplifier chips,a SiGe four-channel multi-function chip and power supply circuit,etc.Radiation efficiency and gain were enhanced by composite substrate with low dielectric constant,which was formed using silicon wafer and low dielectric constant material bonding process.The vertical transmission of microwave signal,digital signal and power supply was realized through silicon via(TSV)and high density bump.The external interface adopted standard ball grid array(BGA)package.The measurement results show that effective isotropic radiated power(EIRP)is more than 31.5 dBm,gain is more than 22 dB and the return loss is less than-13 dB over 34 to 36 GHz with 5-bit phase shift and amplitude attenuation function.The package size is 12.0 mm×14.0 mm×2.6 mm and weight is only 0.75 g,which can be used as a radiation aperture with beam scanning over±30°.