金刚石/铜复合材料制备工艺的研究进展

Research Progress in the Preparation Process of Diamond/Copper Composites

金刚石/铜复合材料具有优异的热导性能,有望解决未来高热流密度电子器件封装和散热难题。该文主要归纳了热压烧结法、高温高压烧结法、放电等离子烧结法以及熔渗法制备金刚石/铜复合材料的详细制备工艺。这方面的进一步成型方式研究是未来的研究重点。

Diamond/copper composite materials have excellent thermal conductivity and are expected to solve the problems of packaging and heat dissipation of electronic devices with high heat flux in the future.This article mainly summarizes the detailed preparation process of hot pressing and sintering method,high temperature and high pressure sintering method,spark plasma sintering method and infiltration method to prepare diamond/copper composite materials.The research on further shaping methods in this aspect is the focus of future research.