附加电场辅助纳秒激光微孔加工试验研究

Experimental study on nanosecond laser micro-hole processing with additional electric field assisted

针对激光微孔加工过程中出现的熔融物质再沉积、微孔锥度大以及存在热影响区等问题,采用波长为355 nm的UV纳秒激光对紫铜表面进行附加电场微孔加工研究。经过试验分析,样品表面的沉积物主要是回落的飞溅颗粒,故而设计附加电极装置,通过附加电场辅助纳秒激光微孔加工来减少表面沉积物,以提高材料表面的微孔质量。试验结果表明,附加电场下微孔入口直径和出口直径均增大,锥度减小,并且随着附加电场强度的增加,微孔锥度减小,样品表面的沉积物减少。当电场强度为150 kV/m时,样品表面的沉积物明显减少,沉积区域直径减小率可达38.2%。

In order to solve the problems such as redeposition of molten material,large taper of micro-hole and existence of heat affected zone,etc.during laser micro-hole processing,the 355 nm UV nanosecond laser was used to fabricate micro-holes on copper surface with additional electric field assisted.Through the experimental analysis,the deposition on the surface of the sample is mainly the falling splashed particles.Therefore,an additional electrode device was designed to reduce the surface deposition through the laser micro-hole processing with additional electric field assisted,and the micro-hole quality of the material surface was successfully improved.The experimental results show that the inlet and outlet diameter of the micro-hole increase,and the taper decreases in the additional electric field.The taper of the micro-hole and the deposition on the sample surface decrease with the increase of the additional electric field intensity.When the additional electric field intensity is 150 kV/m,the deposition on the sample surface decreases significantly,and the reduction rate of the deposition area diameter can reach 38.2%.