板级GP101芯片的焊点可靠性仿真分析

Simulation analysis of solder joint reliability of board-level GP101 chip

国产GPU的研制生产尚处于不成熟阶段,因此存在很多问题,尤以焊点热疲劳和随机振动疲劳为主。通过构建国产GP101单板的板级仿真模型,分别在热载荷和随机振动载荷下对GP101芯片上焊点进行可靠性分析。首先,结合已有的数据和资料,对板级模型进行合理的简化,并借助SolidWorks建立装配体模型。之后在ANSYS Workbench中进行有限元分析,对GP101单板分别施加热载荷和随机振动载荷,研究GP101芯片上焊点的应力应变分布情况,并以此确定危险焊点位置,完成危险焊点的寿命预测。本文给出了GP101单板分别在两种载荷下的可靠性评估,并可为其他器件的板级建模和板级仿真提供参考和借鉴。

The development and production of domestic GPU is still in immature stage,which causes many problems,especially the solder joint thermal fatigue and random vibration fatigue.A board-level simulation model was constructed to evaluate the reliability of the solder joints of GP101 chip under thermal and random vibration load.First of all,combined with existing data and information,the board-level model was reasonably simplified,and the assembly model was established with the help of SolidWorks.After that,the finite element analysis was carried out in ANSYS Workbench.The thermal and random vibration load were separately applied to GP101 printed circuit board to study the distribution of stress and strain of the solder joints on GP101 chip and determine the location of the inferior solder joints to complete the life prediction of the inferior solder joints.This paper respectively gives reliability evaluation of the GP101 printed circuit board under two loads,and also provides reference for the board-level modelling and simulation for other devices.