摘要
为了研究交联薄膜的纳米力学性质,以365 nm波段紫外光催化交联的含蒽聚合物薄膜为对象,用原子力显微镜表征了其在紫外光照射不同时间下表面力学性质的变化。通过划损实验并进行模量表征,发现随紫外光照时间延长使得薄膜交联度增大,且测得硅片基底上薄膜的模量逐渐增加,表明交联使薄膜模量增大;而未经紫外灯照射的薄膜其划损后产生的过渡结构和薄膜之间模量的存在差值,说明空气中的紫外线对薄膜表面具有交联作用。通过对聚二甲基硅氧烷软基底上薄膜的力曲线拐点分析,发现薄膜不同深度处的模量由于交联程度不同而不同;另外,不同成膜基底对薄膜表面模量表征的影响显著,硬硅片基底上的薄膜,其表面弹性模量随着紫外光照射时间增加显著变大;而软的聚二甲基硅氧烷基底弱化了薄膜模量大小,模量值随着紫外光照射时间的增加却变化不大。
In order to study the nanomechanical properties of crosslinked films, afilmwith 365 nm wavelength UV photocatalytic cross-linked anthracene-containing polymer was used as the research object, and the atomic force microscope was used to explore the changes in surface mechanical properties. Through the scratch method and the modulus characterization, it was found that the modulus of the cross-linked film on the silicon wafer substrate increased with UV irradiation time. Also, the difference of the modulus between the transition structure and the film that werenot irradiated by UV also showed that the surface of the anthracene-containing polymer film hada certain cross-linking effect in the air. Through the analysis of the force curve of the film on the polydimethylsiloxane(PDMS) substrate, it was found that the modulus at different depths of the film weredifferent. In addition, this paper also studied the characteristics of the elastic modulus of the film surface on different substrates. For the film on the silicon wafer substrate, the surface elastic modulus increased significantly with the increase of UV irradiation time;while the PDMS substrate weakenedthe film modulus and the modulus almost did not change as the UV irradiation time increases.
作者
雷小娇
李慧琴
韩瑶
梁齐
LEI Xiaojiao;LI Huiqin;HAN Yao;LIANG Qi(School of Material Science and Engineering,Shanghai Jiao Tong University,Shanghai 200240,China;Instrumental Analysis Center,Shanghai Jiao Tong University,Shanghai 200240,China;School of Physics and Astronomy,Shanghai Jiao Tong University,Shanghai 200240,China)
出处
《实验室研究与探索》
CAS
北大核心
2021年第10期55-60,共6页
Research and Exploration In Laboratory
关键词
原子力显微镜
交联薄膜
弹性模量
基底
atomic force microscope
cross-linking
elastic modulus
substrate