纳米银焊膏的研究进展

Research Progress of Nano⁃silver Solder Paste

近些年来,随着5G、人工智能等电子科学技术的进步,半导体器件不断向智能化、高精密、高集成、高可靠方向发展。以航空航天以及雷达的微波射频器件、通信网络基站、大型服务器以及新能源汽车电源模块为代表的半导体器件对半导体器件连接钎料导热性能、可靠性提出了更高的要求。纳米银焊膏由于其低温连接、高温服役性能得到了国内外广泛关注。本文对纳米银焊膏制备烧结机理及烧结性能等方面进行综述,以期推动对纳米银焊膏的研究。

In recent years, with the progress of electronic science and technology such as 5G and artificial intelligence, semiconductor devices are constantly developing towards the direction of intelligence, high precision, high integration and high reliability. Semiconductor devices represented by microwave RF devices of aerospace and radar, communication network base stations, large servers and power modules of new energy vehicles put forward higher requirements on the thermal conductivity and reliability of solder for semiconductor devices. Nano-silver solder paste has been widely concerned at home and abroad because of its low-temperature connection and high-temperature service performance. In this paper,the preparation and sintering mechanism of nano-silver solder paste and its sintering performance were reviewed in order to promote the research of nano-silver solder paste.