摘要
以含硅芳炔树脂(PSA)和苯并噁嗪树脂(BOZ)为基体,Ca_(0.7)La_(0.2)TiO_(3)(CLT)陶瓷为填料,通过本体浇铸成功制备了CLT/PSA/BOZ复合材料。结果表明,加入体积分数为10%的BOZ后,共混树脂的固化收缩率降低了57%。当填料体积分数为50%、测试频率为10 GHz时,CLT/PSA/BOZ(φBOZ=10%)复合材料的介电常数增至30.01,介电损耗因子降至0.0035,弯曲强度增至63.75 MPa,导热系数增至0.6990 W/(m·K),热膨胀系数降至2.3×10^(−5)℃^(−1),同时复合材料质量损失5%的热分解温度(T_(d5))超过900℃。该复合材料的耐高温性能十分优异,在高频通信、集成电路及航空航天等领域应用前景广泛。
CLT/PSA/BOZ composites were prepared by body casting using Si-containg arylacetylene(PSA)and benzoxazine(BOZ)resins as the matrix and Ca_(0.7)La_(0.2)TiO_(3)(CLT)ceramic as the filler.The results show that the curing shrinkage of the resin is reduced by 57%after the addition of 10%(volume fraction)BOZ.When the packing volume fraction is 50%and the test frequency is 10 GHz,the dielectric constant of the composite material increases to 30.01,the dielectric dissipation factor decreases to 0.0035,the bending strength increases to 63.75 MPa,the thermal conductivity increases to 0.6990 W/(m·K),and the thermal expansion coefficient decreases to 2.3×10^(−5)℃^(−1).At the same time,the decomposition temperature of 5%mass loss(T_(d5))is more than 900℃.CLT/PSA/BOZ composites have wide application prospect in high frequency communication,integrated circuit,aerospace and other fields because of their excellent high temperature resistance.
作者
张恒
王桂徽
胡蔚
万立
侯进森
杜磊
邓诗峰
ZHANG Heng;WANG Guihui;HU Wei;WAN Li;HOU Jinsen;DU Lei;DENG Shifeng(Key Laboratory of Specially Functional Polymeric Materials and Related Technology(Ministry of Education),School of Materials Science and Engineering,East China University of Science and Technology,Shanghai 200237,China;Shanghai Composite Technology Co.Ltd,Shanghai 201114,China)
出处
《功能高分子学报》
CAS
CSCD
北大核心
2021年第6期512-519,共8页
Journal of Functional Polymers
基金
装备发展部重点基金(61409220301)。
关键词
含硅芳炔树脂
苯并噁嗪
介电性能
力学性能
热性能
Si-containing arylacetylene resin
benzoxazine
dielectric property
mechanical property
thermal property