柔性OLED器件封装技术研究进展

Research Progress of Flexible OLED Device Packaging Technology

有机电致发光器件(organic light emitting dode,OLED)因具备面光源、冷光、节能、响应快、可柔性、超轻薄和成本低等优点,量产技术日益成熟。从市场需求来看,OLED已经进入高速增长阶段,但因其稳定性差,对水、氧、热都极其敏感,封装技术尤为关键。对柔性OLED器件来说,通过进行严格封装以实现延长寿命、提高稳定性,是其实现量产的必经之路。本文介绍了OLED器件封装技术研究进展,为柔性OLED器件提供了多元化的封装技术,为实现高性能柔性OLED器件提供有效途径与保障。

Organic Light Emitting Diode(Organic Light Emitting Diode,hereinafter referred to as:OLED)has the advantages of active light emission,good temperature characteristics,low power consumption,fast response,flexibility,ultralight and thin,and low cost.The mass production technology has become increasingly mature.OLED has entered a stage of rapid growth in market demand,but because it is extremely sensitive to water,oxygen,and heat,and has poor stability,packaging technology is particularly critical.Strict packaging of OLED devices to extend their life and improve stability is the only way to achieve mass production.This article introduces the research progress of flexble OLED device,provides diversified packaging technologies for flexible OLED devices,and provides effective ways and assurance for realizing highperformance flexble OLED devices.