集成电路人才培养模式新探

On new model for cultivating integrated circuit talent

面对新的集成电路发展形势,提出以MSP430芯片为基础,从芯片前端设计到芯片应用全流程的项目贯穿课程体系,实现"一芯一专业"的培养模式。探索项目贯穿式人才培养体系的课程体系、项目构建模式和能力考核机制;建设项目贯穿式的校企合作实训基地和混编教师教学,实现"一课多师""一课多地"的教学方式。通过在试点学校的应用,取得了良好的教学效果,明显地增强了学生的学习兴趣,显著地提升了学生的职业技能。

Given the new development of integrated circuits,this paper takes the MSP430 chip as the basis and proposes to make the project-through curriculum system cover the whole process from chip front-end design to application to achieve the training mode of"one-chip-one-major".It explores the curriculum system,project construction mode and performance assessment mechanism of the talent training system through projects,and the building of project-through school-enterprise cooperation training base and mixed teacher teaching to achieve"one class by multiple teachers"and"one class on multiple locations".Through the pilot application in some school,this paper finds,the mode has achieved good teaching results,with students’interest in learning significantly enhanced and their vocational skills improved.