聚异丁烯密封胶的合成官能化及其在5G行业的应用

Synthesis,Functionalization of Polyisobutylene(PIB)based Sealant and its Downstream Application for 5G Wireless Telecommunication

对于材料技术而言,5G技术目前面临两项比较有挑战的难题。第一是散热,第二是防腐蚀。对于PCBA板的防腐蚀而言,与一般的结构件相比存在较大不同。需要同时兼顾生产效率,防护效率和降低对高速信号传输的影响。设计并合成了基于聚异丁烯为骨架的高分子材料,通过分子设计,兼顾5G行业对材料的各方需求。

There are two challenges in the wireless 5G Application for material industry.They are heat dissipation and anti-corrosion for PCBA.The anti-corrosion for PCBA is quite different from the structural parts.Productivity,protection level as well as the high-speed transmission rate all have to be taken into account.Through molecule design,PIB backbone was selected as major material to satisfy different requirements from 5G.