热轧温度对退火态高纯钼板显微组织和硬度的影响

Effect of Hot Rolling Temperature on Microstructure and Hardness of High Purity Molybdenum Plate

热轧温度是影响高纯钼板组织均匀性和力学性能的关键因素。本文较系统地研究了不同温度热轧后的钼板坯在1200℃/1 h退火前后的显微组织特征和硬度变化规律。结果表明:随着热轧温度的升高,热轧态钼板的显微组织中出现更多的因动态回复产生的亚结构;热轧态钼板经1200℃/1 h退火后的晶粒尺寸随着热轧温度的升高而逐渐增大,且1500℃热轧的钼板坯退火后出现晶粒尺寸不均匀的现象;随着热轧温度的升高,热轧态和退火态的钼板材显微硬度均呈现逐渐降低的趋势。

Hot rolling temperature is the key factor affecting the microstructure uniformity and mechanical properties of high purity molybdenum plate.In this paper,microstructure characteristics and hardness changes of molybdenum plates hot rolled at different temperatures before and after annealing at 1200℃/1 h were systematically studied.The results show that with the increase of hot rolling temperature,there are more subgrain structures due to dynamic recovery in the microstructure of hot rolled molybdenum plate.The average grain size of hot rolled molybdenum plate after annealing at 1200℃/1 h increases gradually with the increase of hot rolling temperature,and the grain size of molybdenum plate hot rolled at 1500℃is uneven after annealing.With the increase of hot rolling temperature,microhardness of hot rolled and annealed molybdenum plates decreases gradually.