某电子设备的热设计及优化

Thermal Design and Optimization of Electronic Equipment

在某电子设备的设计中,通过合理布局、选择散热方案以及计算风机与散热器的参数,保证设备内热敏元器件的工作温度小于额定温度。利用6sigma软件对设备设计进行热仿真分析,通过分析仿真结果优化风道散热方案。对优化后的设备进行热仿真分析,对比优化前后的设计参数和仿真结果,风扇安装距设备后端40 mm处风阻最小,风道内风量更加均匀。电源模块热敏器件壳温降低了7.7℃,满足使用要求,证明了对风道和散热方案优化的合理性。

In the design of an electronic device,through reasonable layout,selection of heat dissipation schemes,and calculation of the parameters of the fan and radiator,it is ensured that the operating temperature of the thermal components in the device is less than the rated temperature.Use 6sigma software to conduct thermal simulation analysis on the equipment design,and optimize the air duct heat dissipation scheme by analyzing the simulation results.Perform thermal simulation analysis on the optimized equipment,and compare the design parameters and simulation results before and after optimization.The wind resistance at 40 mm from the rear of the equipment is the smallest,and the air volume in the air duct is more uniform.The case temperature of the thermal device of the power module is reduced by 7.7℃,which meets the requirements of use,which proves the rationality of the optimization of the air duct and heat dissipation scheme.