基于Deform宽板弯曲应力中性层位置的数值分析及模拟

Numerical analysis and simulation on stress neutral layer position of bending for wide plate based on Deform

为了确定宽板弯曲变形过程中应力中性层位置、提高弯曲件的成形精度,通过对宽板弯曲时其截面微元体的受力情况进行分析,采用经典的力学分析假设建立了微分方程,确定了应力中性层位置和相对弯曲半径以及变薄系数之间的数学关系,发现了宽板在弹塑性弯曲变形过程中,应力中性层位置向板材内层移动,同时,应力中性层位置与中宽板中心层位置之差随着弯矩的增大而增大,通过Deform软件和弯曲模具设计实验,验证了理论研究结果,弯曲件工艺设计中可根据材料的变形程度得到变薄系数和内移系数的取值范围,进而指导实际生产。

In order to determine the position of stress neutral layer in the bending process of wide plate and improve the forming accuracy of bending parts, by analyzing the stress of the micro element at the section of wide plate during bending, the differential equation was established by the classical mechanical analysis hypothesis, and the mathematical relationship among the position of stress neutral layer, the relative bending radius and the thinning coefficient was determined to obtain that the position of stress neutral layer shifted to the inner layer of plate during the elastic-plastic bending deformation process of wide plate. At the same time, the difference between the position of stress neutral layer and the position of center layer of medium wide plate increased with the increasing of bending moment. Furthermore, the theoretical research results were verified by software Deform and bending die design experiments, and in the process design of bending parts, the value ranges of thinning coefficient and inward shift coefficient were obtained according to the deformation degree of materials so as to guide the actual production.