含硫有机添加剂对电解铜箔组织性能的影响

Effect of Sulfur-containing Organic Additives on the Structure and Performance of Electrolytic Copper Foil

采用自制镀液循环电解铜箔实验装置研究了在含胶原蛋白的电解液中加入0~6 mg/L聚二硫二丙烷磺酸钠(SPS)对电解铜箔组织性能的影响。随着SPS质量浓度增加,铜箔光泽增加,粗糙度和抗拉强度降低。利用扫描电镜(SEM)、X射线衍射仪(XRD)、电子背散射衍射(EBSD)分别对电解铜箔微观形貌和组织结构进行分析,发现SPS使铜箔表面由粗糙变得平整,铜箔的晶面择优取向由(220)变为(200)。

The effect adding of 0~6 mg/L bis-(sodium sulfopropyl)-disulfide(SPS)in the electrolyte containing collagen on the structure and performance of electrolytic copper foil was studied by using a self-made electrolytic copper foil experimental device for electrolyte circulation.As the concentration of SPS increases,the gloss of copper foil increases,and the roughness and tensile strength decrease.Scanning electron microscope(SEM),X-ray diffractometer(XRD)and electron backscatter diffraction(EBSD)were used to analyze the micro morphology and structure of electrolytic copper foil,it was found that SPS makes the surface of the copper foil change from roughness to leveling,and the preferred orientation of the crystal plane of the copper foil changes from(220)to(200).