电解铜箔在印制电路板端的评估方法研究

Research on measuring methods for ED copper foil by the PCB enterprises

文章概述了电子铜箔的分类,介绍了电解铜箔表面处理工艺流程及对性能的影响;从CCL组分(铜箔)级、CCL级、PCB级三个层次梳理了相关标准对铜箔性能的评价项目。结合问题案例,从PCB端重点研究了铜箔的评估方法,包括:抗剥强度,抗氧化性和微蚀性,蚀刻性及绝缘性,并分析了影响因素,提出了注意事项。

This paper summarizes the types of copper foil,and briefly introduces the surface treatment process flow of electrodeposited(ED)copper foil and its influence on performance.This paper interprets the measuring items in the industry standards related to copper foil from three levels including component(copper foil),CCL and PCB.Combining abnormal cases,this paper carries on the research of measuring methods,including peel strength,oxidation resistance,corrosion resistance,etching property and insulation.At the same time,the influence factors are analyzed and same attention are put forward.