摘要
随着印制电路板传输速率的要求越来越高,对材料损耗的要求也是进一步提升,出现了甚低损耗级别的基材,这类型的材料使用的是特殊树脂,如PPO、氰酸酯、PTFE。印制板加工主要使用等离子体除胶,普通的除胶测量方法已经不能满足此类材料的检测需求。此方法主要是针对使用高频高速材料的高多层印制板,为了更高效又准确的检测此类材料等离子体除胶后孔内实际除胶情况。
With the increasingly high requirements on PCB transmission rate,the requirements on material loss are also further improved.Materials of very low-loss level appear.These materials use special resins,such as PPO,cyanate ester and PTFE.Ordinary degelling measurement methods can no longer meet the detection requirements of such materials.This method is mainly aimed at high-layer PCBS with high-frequency and highspeed materials,in order to more efficiently and accurately detect the actual degelling situation of such materials in the Plasma desmear hole.
作者
欧阳川磊
王立峰
潘俊健
OuYang Chuanlei;Wang Lifeng;Pan Junjian
出处
《印制电路信息》
2021年第12期30-34,共5页
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