基于双色分离成像法的晶粒双面同时等光程共焦成像检测

A new optical apparatus for inspecting adjacent surfaces defects of TEC components based on double color separation and confocal imaging system

目前机器视觉常被用于大批量重复性工业生产过程,以及一些人工视觉难以满足要求的场合,通过机器视觉检测方法可以大大提高生产的效率和自动化程度。对于一些需要多面高精度检测的物体,如半导体晶粒,往往需要每一面配置一套图像采集系统,利用多套机构实现多面检测,增加了安装复杂性,降低了系统可靠性。提出了一种基于双色分离成像法的半导体晶粒双面同时等光程共焦成像检测的装置及方法,从而减少需配置的图像采集系统的数量,降低系统复杂性。该装置可实现晶粒相邻面同时完全等光程共焦成像,可用于需多面检测的机器视觉自动检测领域,从而可以在实际制造过程中降低成本。

At present,machine vision is often used in large-scale repetitive industrial production process and some occasions where artificial vision is difficult to meet the requirements,through the machine vision detection method can greatly improve the production efficiency and automation.For some objects that need multi-faceted high-accuracy detection,such as semiconductor thermoelectric cooler(TEC) components,it is often necessary to configure an image acquisition device for each facet and use multiple sets of mechanisms to realize multi-facet detection,which increases the complexity of installation and reduces the reliability of the device.Simultaneous equal optical path confocal imaging of semiconductor TEC components’ two adjacent surfaces based on two-color separation imaging method is proposed,so as to reduce the number of image acquisition devices and the complexity of the device.The device can realize the same optical path confocal imaging of two adjacent surfaces of the TEC component simultaneously,and can be found applications in the automatic inspection fields of machine vision which needs multi-facet inspection,so as to reduce the cost in the actual manufacturing process.