摘要
通过实验优化了方形基片喷雾涂胶工艺。以AZ6130光刻胶作为研究对象,实验过程中在改变胶液体积流量和氮气压力条件下,采用二流体喷头对方形基片进行喷涂,使用显微镜和粗糙度轮廓仪观察并测量其表面形貌。实验结果表明:在不改变其他实验条件下,氮气压力为0.03 MPa时,随着胶液体积流量从0.6 mL/min增加至2.2 mL/min,胶膜厚度从5.3μm增加至19.0μm,膜厚均匀性从3.5%增加至22.6%;胶液体积流量为1.0 mL/min时,随着氮气压力从0.01 MPa增加至0.09 MPa,胶膜厚度从6.5μm降低至4.7μm,膜厚均匀性从3.6%增加至15.6%。通过对实验基片的观察、测量与分析,得到方形基片制备过程中最优喷涂工艺为胶液体积流量1.0 mL/min,氮气压力0.03 MPa。
The spray coating process for square substrates was optimized through experiments.AZ6130 photoresist was taken as the research object.In the experimental process, under the conditions of changing the glue volume flow and nitrogen pressure, the square substrate was sprayed with a two fluid nozzle, and the surface morphology was observed and measured by the microscope and roughness profiler.The results show that without changing other experimental conditions, when the nitrogen pressure is 0.03 MPa, with the increase of the glue volume flow uniformity rate from 0.6 mL/min to 2.2 mL/min, the glue film thickness increases from 5.3 μm to 19.0 μm, and the film thickness uniformity increases from 3.5% to 22.6%.When the glue volume flow is 1.0 mL/min, with the increase of the nitrogen pressure from 0.01 MPa to 0.09 MPa, the glue film thickness decreases from 6.5 μm to 4.7 μm, and the film thickness uniformity increases from 3.6% to 15.6%.Through the observation, measurement and analysis of the experimental substrate, the optimal spray coating process in the preparation of the square substrate is obtained as the glue volume flow of 1.0 mL/min and the nitrogen pressure of 0.03 MPa.
作者
陈威
王河
党景涛
Chen Wei;Wang He;Dang Jingtao(The 45th Research Institute,CETC,Beijing 100176,China)
出处
《半导体技术》
CAS
北大核心
2021年第12期969-973,共5页
Semiconductor Technology
关键词
方形基片
喷涂工艺
二流体喷头
胶膜厚度
膜厚均匀性
square substrate
spray coating process
two fluid nozzle
glue film thickness
film thickness uniformity