摘要
陶瓷柱栅阵列(Ceramic Column Grid Array,CCGA)封装器件已在航空航天等高可靠性产品中得到了广泛应用,其中铜带缠绕型焊柱因其强度更高、韧性更好的优良性能而备受关注。针对铜带缠绕型CCGA器件的植柱工艺,通过ANSYS数值模拟分析,仿真研究了焊柱尺寸、回流曲线、焊膏厚度等参数对CCGA器件残余应力及变形量的影响,并通过正交试验寻找最佳工艺参数。结果表明,植柱工艺中制备铜带缠绕型CCGA器件的最优工艺组合为焊柱内径0.40 mm、柱高3.81 mm、焊料厚度30.00μm、降温速率2.00℃/s。
Ceramic column grid array(CCGA)packaging devices have been widely used in aerospace and other high reliability products,among which the copper strip winding welding column has attracted more attention because of its higher strength and better toughness.Using ANSYS finite element analysis software,the influence of parameters such as welding column structure size,reflux curve and solder paste thickness on CCGA residual stress and deformation is simulated and analyzed,and the optimal process parameters are found through orthogonal test.The results show that the optimal process combination for preparing copper-strip winding CCGA device is as follows:0.40 mm inner diameter of welding column,3.81 mm column height,30.00μm solder thickness and 2.00℃/s cooling rate.
作者
田文超
刘美君
辛菲
张国光
陈逸晞
TIAN Wenchao;LIU Meijun;XIN Fei;ZHANG Guoguang;CHEN Yixi(School of Mechano-Electronic Engineering,Xidian University,Xi’an 710068,China;Foshan Blue Rocket Electronics Co.,Ltd.,Foshan 528051,China)
出处
《电子与封装》
2021年第12期45-49,共5页
Electronics & Packaging
基金
芜湖-西电产学研专项资金(XWYCXY-012020015)。
关键词
铜带缠绕型焊柱
有限元仿真
残余应力
copper strip winding welding column
finite element simulation
residual stress
