摘要
近年来,高性能智能化CMOS图像传感器芯片作为视觉信息获取的核心部件,日益成为国家重大科技研究项目(如载人航天、大飞机、高分辨率对地观测等)航天与空间探测领域的重要基础和技术支撑。三维集成的图像传感器芯片架构为构建智能化成像系统奠定了基础,模拟生物视觉感知机理的智能仿生图像传感器有效解决了分辨率和帧频不断提高的需求带来的感知与处理能力的挑战,同时还具有大动态范围、低数据冗余和低功耗等优势。文章在分析了智能化成像机理的基础上,调研了国际上多种仿生CMOS图像传感器的研究进展并分析了智能化成像与识别的关键技术,展望了该领域未来研究的可能发展方向,为抢占智能化CMOS图像传感器技术的制高点提供参考。
In recent years, as the core component of visual information acquisition, high-performance intelligent CMOS image sensors have increasingly become critical foundations and technical support for major national scientific and technological research projects such as manned spaceflight, large aircraft,high-resolution earth observation and other aerospace and space exploration fields. The three-dimensional integrated image sensor chip architecture lays the foundation for the construction of an intelligent imaging system. The intelligent bionic image sensor that simulates the mechanism of biological visual perception solves the challenges of perception and processing capabilities brought by the continuous increase in resolution and frame rate. It also has the advantages of large dynamic range, low data redundancy and low power consumption.Based on the analysis of the mechanism of intelligent imaging, this paper investigates the research progress of a variety of bionic CMOS image sensors and analyzes the key technologies of intelligent imaging and recognition.It provides a reference for the commanding heights of CMOS image sensor technology.
作者
徐江涛
程思璐
XU Jiangtao;CHENG Silu(School of Micro-electronics,Tianjin University,Tianjin 300072,China;Tianjin Key Laboratory of Imaging and Sensing Microelectronic Technology,Tianjin 300072,China)
出处
《航天返回与遥感》
CSCD
北大核心
2021年第6期95-110,共16页
Spacecraft Recovery & Remote Sensing
基金
国家自然科学基金(61774110)。
关键词
互补金属氧化物半导体图像传感器
智能化成像
生物视觉
三维堆叠
Complementary Metal Oxide Semiconductor(CMOS)image sensor
intelligent imaging
biological vision
three dimension stacking