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High-strength diffusion bonding of oxide-dispersion-strengthened tungsten and CuCrZr alloy through surface nano-activation and Cu plating 被引量:1

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摘要 Oxide-dispersion-strengthened tungsten(ODS-W)and a Cu Cr Zr alloy were bonded by a three-step process:(i)surface nano-activation,(ii)copper plating followed by annealing,and(iii)diffusion bonding.The morphological and structural evolutions of ODS-W and the interface of the ODS-W/CuCrZr joint during these processes have been thoroughly studied by X-ray diffraction,scanning electron microscopy,energy dispersive spectrometry,and high-resolution transmission electron microscopy.After surface nanoactivation,a nanoporous structure of ODS-W with an average pore size of~100 nm was obtained,and the Y_(2)O_(3)particles therein remained unchanged.A Cu coating was tightly bonded with the surface nanoactivated ODS-W after Cu plating and annealing.An interaction layer embedded with nanosized W particles was formed at the interface between ODS-W and plated Cu after the three-step process.Consequently,well-cohesive ODS-W/Cu and ODS-W/Y_(2)O_(3)/Cu interfaces were formed.The ODS-W/Cu Cr Zr joint showed high shear strengths(up to 201 MPa)and effective bonded area ratios(>98%).The developed three-step bonding process between ODS-W and the Cu Cr Zr alloy provides an effective support for future plasma-facing components in nuclear fusion reactor applications.
出处 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2021年第33期186-194,共9页 材料科学技术(英文版)
基金 supported by the National Key Research and Development Program of China(No.2017YFE0302600 and No.2018YFB0703904)。
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