电子封装异质材料连接研究进展

Progress of Dissimilar Materials Bonding in Electronic Packaging

随着摩尔定律趋于失效,3D封装和大功率器件的普及,具有较强散热能力的陶瓷基板、硅基板必将加速推广,由此引发更多的异质材料互连问题。综述了电子封装领域常用金属与金属,陶瓷与金属等异材互连研究进展,指出实现免热沉陶瓷与金属直接低温封接迫在眉睫,焊料添加更多的贵金属及稀有活性金属、焊料尺寸从传统块状或大尺寸颗粒向具有较强活性的纳米线或纳米颗粒转变,封装技术从传统的回流焊、压焊向飞秒激光、激光局部加热等大功率密度、局部热源及复合热源方向转变,封装可靠性从传统的热老化、热循环、热冲击向极端温度、极端温度梯度、快速温度转换和多场协同作用下的可靠性方向转变。

As Moore’s law tends to fail and the popularization of 3D packaging and high-power devices,ceramic substrates and silicon substrates with strong heat dissipation capabilities will inevitably be promoted,which will give rise to more interconnection problem of dissimilar materials.This article reviewed the research progress of dissimilar material interconnection between metals and metals,ceramics and metals,which were commonly used in the field of electronic packaging,and pointed out that it was imminent to realize direct low-temperature packaging of ceramic and metal without metallized layers.More precious metals and rare active metals were added to the solder which had changed from traditional bulk or large-size particles to nanowires or nanoparticles with strong activity.The packaging technology had changed from conventional reflow soldering and pressure welding to high power density,local heat source and hybrid heat source such as femtosecond laser,and laser local heating.Packaging reliability had transformed from traditional thermal aging,thermal cycling,and thermal shock to extreme temperature,extreme temperature gradient,rapid temperature conversion,and reliability under the synergy of multiple fields.