摘要
结合实践生产需要,以高密度互连(HDI)印制板上主流陶瓷焊球阵列封装器件(CBGA)、陶瓷柱栅阵列封装器件(CCGA)、芯片级封装器件(CSP)等球栅阵列封装器件(BGA)封装芯片为研究对象,根据芯片数据手册(Datasheet)和印制电路板集成(PCB lib)封装库的提取自主设计工艺电路板。梳理BGA返修工艺流程确定总体实施方案,着重对印制电路板(PCB)和器件封装库设计、真空汽相回流焊接区间控温、BGA值球、 HR600装焊等关键技术开展工艺技术研究,给出实践经验和工艺方法,BGA焊接质量经检验合格满足QJ 3086A—2016标准要求,利用Minitab统计工具对其进行C_(pk)过程能力评价,表明达到高可靠性的BGA返修工艺。
Combined with the practical production needs,the main BGA encapsulation chips such as CBGA,CCGA and CSP in HDI PCB are taken as a research object,and the process circuit board is independently designed according to the extraction of Datasheet and PCB Lib encapsulation library.The implementation plan of BGA repair process is summarized,and the valuable practical experience and process method are given for the process technology research of key technologies such as PCB and device packaging library design,interval temperature control of vacuum steam phase reflow welding,BGA plant ball,HR600 assembly and welding,through the BGA welding quality inspection meets the QJ 3086-2016 standard.The Minitab statistical tool is used to evaluate the C_(pk) process capability to achieve a highly reliable BGA repair process.
作者
朱宁
郭鹏飞
刘鼎
王辰宇
王宁
Zhu Ning;Guo Pengfei;Liu Ding;Wang Chenyu;Wang Ning(Beijing Aerospace Control Instrument Research Institute,Beijing 100854,China;China Astronautics Standards Institute,Beijing 100071,China)
出处
《质量与可靠性》
2021年第5期26-30,35,共6页
Quality and Reliability
