采用短脉冲激光进行微盲孔加工研究

Research of microvia processing by short pulse laser

研究激光孔加工的目的是为了寻找高密度互连印制电路板微盲孔加工的先进工艺。短脉冲激光钻机具有比现有长脉冲激光钻机更高更集中的能量,它们是微盲孔加工技术发展的一个候选者。若采用此类激光钻孔方式,玻璃纤维及树脂等很容易被短脉冲激光去除,也就更有利于微盲孔加工技术提高。

The research purpose of laser hole processing is to find the advanced technology of micro blind hole processing of higher density interconnect Printed Circuit Board.Short pulse laser drilling machine has higher and more concentrated energy than existing long pulse laser drilling machine,so it is a candidate for the development of micro blind hole technology.If this kind of laser drilling method is adopted,glass fiber and resin can be easily removed by short pulse laser,which is more conducive to the improvement of micro-blind hole processing technology.