影响挠性印制板插入损耗的几种因素

Several factors affecting insertion loss of FPCB

文章采用三层板叠构对高频通信用挠性印制板(FPCB)的插损进行测试对比,从制造FPCB的材料种类、材料厚度、胶层厚度、仿真设计、信号线过孔类型、盲孔质量,以及信号线阻抗值大小等多个因素总结出对最高频率到20GHz信号插损的影响。

In this paper,the insertion loss of FPCB for high frequency communication is tested and compared by using three-layer structure.The influence on the insertion loss of the highest frequency of 20 GHz signal is summarized from the material type,material thickness,adhesive thickness,simulation design,signal line through hole type,blind hole quality,and signal line impedance value of FPCB.