不同封装面结构的硅铝管壳激光封焊工艺

Laser Welding Technology of Si-Al Alloy Package with Different Packaging Surface Structure

微波模块向着小型高可靠的方向发展,硅铝合金得到了广泛应用。对硅铝管壳激光封焊的工艺进行了研究,重点讨论了不同封装面结构硅铝管壳的激光封焊工艺,针对封焊过程中出现的热裂纹进行了分析。在此基础上,对封焊过程中的脉冲波形、峰值功率、离焦量、起始点位置等工艺参数进行了优化。结果表明,在合适的参数下,可在不同封装面结构的硅铝管壳的封装体积>15 cm^(3)时,激光封焊的漏率低于2.03×10^(-8) Pa·cm^(3)/s。在热震、温循、正弦振动等环境筛选试验后,焊缝保持完好状态。

Aiming at the development of microwave module in the direction of miniaturization and high reliability,silicon aluminum alloys has been widely used.The laser sealing welding of Si-Al shell is studied.Focusing on the laser sealing welding process of silicon aluminum alloys with different packaging surface structures,the thermal cracks in the welding process are analyzed.On this basis,the process parameters such as pulse waveform,peak power,defocus and starting point position are optimized.The results show that under the appropriate parameters,the leakage rate of laser welding of Si-Al shell with different packaging surface can be lower than 2.03×10^(-8) Pa·cm^(3)/s when the packaging volume greater than 15 cm^(3).After environmental screening tests such as thermal shock,temperature cycle,sinusoidal vibration,etc,the welds remain intact.