摘要
随着我国科学技术与经济的不断发展与推进,电子行业得到飞速发展。电子器件性能的提升和尺寸的微型化,使得电子器件的热流密度越来越高,但传统的风冷方式已不能满足其冷却要求。本文分析几种电子器件冷却技术的工作原理、优缺点、研究现状及所存在的关键问题,最后进行总结和展望。
With the continuous development and promotion of science&.technology and economy in China,the electronic industry has been developing rapidly.With the im-provement of the performance of electronic devices and the mi niaturization of their sizes,the heat flux density of electronic devices is higher and higher,but the traditional air cool-ing can not meet the requirements of their heat dissipation.The working principle,advan-tages&.disadvantages,the research status and key problems of various cooling technolo-gies are analyzed,the summarization and prospects are made finally.
作者
宁璐璐
刘清江
杨凤
晋梦轩
Ning Lulu;Liu Qingjiang;Yang Feng;Jin Mengxuan(Key Laboratory of Tianjin Refrigeration Technology,School of Mechanical Engineering,Tianjin University of Commerce)
出处
《制冷与空调》
2021年第12期1-7,共7页
Refrigeration and Air-Conditioning
基金
2020年天津市大学生创新创业训练计划项目(202010069190)。
关键词
电子器件
冷却技术
射流
微通道
喷雾相变
electronic device
cooling technology
jet
microchannel
spray phase transition