导流装置应用于金属波导内腔电镀金

Application of flow guiding device to gold electroplating of metallic waveguide cavity

金属波导内腔空间小,电镀时存在严重的浓差极化现象,导致镀层厚度分布不均。在电镀金时通过增加导流装置来加快波导内腔镀液的流动和更新,获得的电镀金层厚度在1μm以上,并且分布均匀。

Serious concentration polarization occurs during the electroplating of metal waveguide cavity due to the extremely small space inside,leading to nonuniform thickness distribution of coating.A flow guiding device was used to accelerate the flow and exchange of solution in metal waveguide cavity during gold electroplating.The gold coating obtained therewith featured uniform thickness distribution above 1μm.