基于专利数据的芯片领域技术创新动态测度

Dynamic Measurement of Technology Innovation in the Chip Field based on Patent Data

芯片是电子信息产业的核心,是现代工业的“食粮”,对其技术创新进行测度有助于了解芯片领域的发展情况。基于DII数据,以芯片技术为研究对象,采取专利计量学、社会网络分析方法,通过芯片领域全球专利产出情况来分析其空间和时间趋势、合作特征、核心机构和关键核心技术等。结果表明:1991—2008年该领域技术产出显著增长;日本是该领域技术创新的领跑者,少数国家/地区和组织处于芯片技术创新的主体地位;2001—2010年该领域组织机构合作网络显著扩张,且合作网络形成明显的区域集群;芯片技术领域的核心机构主要是来自日本的企业,其次是韩国和美国,中国台湾地区的台积电在世界上也处在领先位置;芯片领域的关键核心技术主要包括半导体或电固体相关的器件及处理它们的方法或设备(H01L)、电设备的外壳或结构零部件及制造(H05K)、用物理或化学方法对金属材料的镀覆(C23C)等。研究成果可为研究人员、决策者、研究资助者等提供借鉴。

In the past three decades,the semiconductor industry has been one of the most im⁃portant industries,and has become a core upstream element in almost every part of the electron⁃ics industry due to it's wide range of applications in communications,consumer electronics,com⁃puters,etc.In the semiconductor industry,chip technology has always been a strategic high point for countries to carry out fierce competition.In recent years,China has developed rapidly in science and technology and has become a science and technology developed country interna⁃tionally.But there are still obvious shortcomings in some key areas of industrial technology.The ZTE and Huawei incidents in recent years have also sounded an alarm to China's semiconductor industry,and we are facing the dilemma of bottlenecks.In order to break through this dilemma,keeping the key core technology firmly in our own hands,we need to mainly rely on scientific and technological innovation.Technological innovation capability is largely reflected in a coun⁃try's patenting activities,and the analysis of the technological innovation dynamics and techno⁃logical evolution picture behind a particular technology field can help to obtain valuable informa⁃tion about the development direction and optimal development layout of the field.This study ana⁃lyzes the technological innovation landscape of the chip field with the aim of identifying the cur⁃rent status and development direction of the field in order to provide a reference for further scien⁃tific and technological innovation in the field.Specifically,based on Derwent(DII)data,this study uses patent metrology and social network analysis methods to analyze spatial and temporal trends,cooperation characteristics,core institutions and key core technologies through the global patent output in the chip field.The results of the study show that the technological output in this field grew significantly between 1991 and 2008.Japan is the leader of technological innovation in this field,and a few countries/regions and organizations are in the main position of chip tech⁃nological innovation.The cooperation network of organizations and institutions expanded signifi⁃cantly from 2001 to 2010 and formed obvious regional clusters.The core institutions in the field of chip technology are mainly companies from Japan,followed by the United States and South Korea.Taiwan Semiconductor Manufacturing Company,in Taiwan of China,is in a leading posi⁃tion in the world.SMIC of China's Mainland has shown its international status during 2001 to 2020.However,despite high innovation power,its control power is at a low level.The key core technologies in the chip field mainly include semiconductor or electrical solids-related devices and methods or equipment for handling them(H01L),housing or structural parts and manufactur⁃ing of electrical devices(H05K),coating of metallic materials by physical or chemical methods(C23C),etc.This research can provide lessons for researchers,policy makers,research funders,etc.