芯片电镀铜添加剂的研究进展

Research Progress of the Copper Electroplating Additives in Chip Manufacturing

添加剂是芯片电镀铜过程中实现无空隙填充必不可少的一部分。电镀液成分复杂,各类添加剂如加速剂、抑制剂以及整平剂在电镀过程中的协同作用机制需要进一步研究。为揭示芯片电镀铜添加剂的反应机理,本论文综述了国内外相关的研究工作,对电镀铜添加剂的种类和相互作用进行了分析和总结,并指出了今后的发展方向。

Additives are an indispensable part of the chip copper electroplating process to achieve void free filling.The composition of the electroplating solution is complex,and the synergistic mechanism of various additives such as accelerators,inhibitors and levelers in the electroplating process needs to be further clarified.In order to reveal the reaction mechanism of copper electroplating additives for chips,both domestic and foreign related researches were reviewed in this article.Additionally,the types and interactions of copper electroplating additives were analyzed and summarized and the future develop‐ment direction was pointed out.