摘要
为了定量研究共型屏蔽对系统级封装(SiP)近场辐射的影响,基于课题组的近场扫描平台,对近场测试过程中超小型连接器(SMA)对测试的影响进行分析,提出将SMA与SiP分别设置在印制电路板(PCB)两侧的设计方案,有效地抑制了SMA处场泄漏对SiP辐射测试的影响。发现不同屏蔽效能定义方式所得的屏蔽效能结果有一定差异,并给出不同屏蔽效能评估方式的优劣。最后,通过仿真验证了缝隙泄漏是高频屏蔽效能恶化的主要原因。
In order to quantitatively analyze the influence from conformal shielding to the radiation of system-in-package (SiP),based on our near-field scanning platform,we analyze the impact of SMA connector in measurement.In addition,we propose the design plan that assembling SMA and SiP at two sides of PCB which can efficiently suppress the influence from leakage field to SiP radiation.Meanwhile,we find there are differences between different definition of shielding effectiveness calculations and we analyze their advantages and disadvantages for each definition.Finally,we figure out that the leakage field from gap is the main reason resulting in shielding effectiveness decrease in high frequency range by simulation.
作者
丁力
魏兴昌
Ding Li;Wei Xingchang
基金
国家自然科学基金(61871467)。
关键词
系统级封装
超小型连接器
共型屏蔽
近场扫描
印制电路板
system-in-package(SiP)
Sub-miniature-A connector(SMA)
conformal shielding
near-field scanning
printed circuit board(PCB)
