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基于EMC技术的PCBA板级可靠性测试案例分析 被引量:1

Analysis of PCBA Board Level Reliability Test Case Based on EMC Technology
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摘要 为了使用正确的方法进行电磁兼容(EMC)测试,精准发现印刷电路板组件(PCBA)存在的潜在EMC性能缺陷,基于相关标准与EMC理论,设计了具体的PCBA板级ESD抗扰度测试、电快速瞬变脉冲群测试与浪涌冲击等典型测试方法。完善了PCBA板级EMC可靠性测试体系,并结合案例分析说明了该测试方法的适用性,为PCBA板级EMC可靠性评价和改善提供了指导。 In order to use the correct method for EMC test and accurately find the potential EMC performance defects of PCBA,specific typical test methods such as PCBA board level ESD immunity test,electrical fast transient pulse group test and surge impact are designed based on relevant standards and EMC theory.Thus,the PCBA board level EMC reliability test system is improved,and the applicability of the test method is illustrated combined with case analysis,which provides guidance for PCBA board level EMC reliability evaluation and improvement.
作者 江徽 马勇 解维坤 张凯红 Jiang Hui;Ma Yong;Xie Weikun
出处 《安全与电磁兼容》 2022年第1期81-84,共4页 Safety & EMC
关键词 电磁兼容 印刷电路板组件 测试方法 可靠性 EMC PCBA test method reliability
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