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基于Cortex-M7的32位ARM高速ADC采集电路 被引量:6

32-bit ARM High-Speed ADC Acquisition Circuit Based on Cortex-M7
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摘要 由于传统的ADC电路所使用的对接芯片价格昂贵,处理器的速度较低,所以亟需一种ADC采集电路来解决电信号传输效率较低和采集成本高的问题。研究并设计一种以STM32H743IIT6单片机和Cortex-M7处理器为核心的高速ADC采集电路,通过该电路实现超高速的AD转换,同时降低了研发成本。 Due to the high price and low processor speed of docking chips used in traditional ADC circuits,an ADC acquisition circuit is needed urgently to solve the problem of low transmission efficiency of electrical signals and reduce acquisition cost.Therefore,this paper studies and designs a high-speed ADC acquisition circuit based on STM32H743IIT6 microcontroller and Cortex-m7 processor.With this circuit,the ultra-highspeed AD conversion can be realized and the research and development cost can be reduced.
作者 潘嵩 鞠振河 赵音 PAN Song;JU Zhen-he;ZHAO Yin(School of Electric Power,Shenyang Institute of Engineering,Shenyang 110136;School of New Energy,Shenyang Institute of Engineering,Shenyang 110136;College of Horticulture,Shenyang Agricultural University,Shenyang 110866,Liaoning Province)
出处 《沈阳工程学院学报(自然科学版)》 2022年第1期62-65,74,共5页 Journal of Shenyang Institute of Engineering:Natural Science
关键词 单片机 Cortex-M7处理器 ADC采集电路 Singlechip Cortex-m7 processor ADC acquisition circuit
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  • 1王瑱,陶然,单涛.AD9764和高速FIFO在TMS320C6701系统中的应用[J].微计算机信息,2004,20(7):80-82. 被引量:2
  • 2Bogain E. Signal Integrity: Simplified[M]. Indiana : Prentiee Hall Professional, 2004: 100-203.
  • 3Simonovich L, Bogatin E, Cao Y. Differential via modeling methodology[J]. IEEE Trans. on Components, Packaging and Manufacturing Teehnol. , 2011, 1(5) :722-730.
  • 4Shen Z W,Tong J. Signal integrity analysis of high- speed single-ended and differential vias[C]//2008 10th Electron. Packaging Teehnol. Conf. , 2008:65-70.
  • 5Cao Y,Simonovich L, Zhang.Q J. A broadband and parametric model of differential via holes using space- mapping neural network[J]. Microwave and Wireless Components Lett. , IEEE, 2009, 19(9): 533-535.
  • 6RenG, Zhou R. The signal integrity analysis of differential signal based on hyperlynx[C]//IEEE 2010 Inter. Conf. on Computer, Mechatronics, Control and Electron. Engineering, 2010(5): 269-272.
  • 7Jing J,Lingwen K. Study of signal integrity for PCB level[C]// IEEE 2010 llth Inter. Conf. on Electron. Packaging Technol. & High Density Packaging, 2010: 828-833.
  • 8Bogatin E, Simonovich L, Gupta S, et al. Practical analysis of backplane vias[J]. DesignCon. 2009:1-24.
  • 9Laermans E,De Geest J, De Zutter D, et al. Modeling differential via holes[J]. IEEE Trans. on Advanced Packaging, 2001, 24(3): 357-363.
  • 10Yang Q, Ali M. Modeling and analysis of vias in multilayered integrated circuits[J] . IEEE Trans. on Microwave Theory and Techniques, 2008 , 41 (2): 21-27.

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