密闭产品的热结构设计和分析

Thermal Simulation Design and Analysis of Sealed Products

电子设备要求无风扇、自然散热的密闭结构,在要求的温度范围内正常工作。先对产品进行热流密度分析和计算,确定密封结构下热设计要求的可行性;然后借助Flotherm热仿真软件对产品进行热设计分析,完成内部模块布局、PCB板的芯片的热处理、散热器设计,热仿真计算优化产品设计,设计出满足产品要求的最佳方案,为产品设计提供依据。

Electronic equipment is designed sealed structure of no fan and natural heat dissipation,and works normally within the required temperature range.The feasibility of the thermal design requirements is determined by analyzing and calculating the thermal power consumptionof the product functional module and the heat flux density of the heatdissipation surface under the thermal steady state of the chassis.The thermal design of the product is finishedby the thermal simulation software of Flotherm,including the internal modulelayout,the heat treatment of the chip of the PCB board and the radiator design.The best scheme meeting the productrequirements is designed to provide basis for product by the thermal simulationcalculation of the product and optimizing the productdesign.