太阳能硅片清洗剂TF-014的研制

Development of Cleaning Agent TF-014 for Solar Silicon Wafers

介绍了一种太阳能硅片清洗剂TF-014的制备方法和应用性能,该清洗剂适用于金刚线切割超声清洗工艺,不仅具有优秀的去油污和金属离子螯合能力,而且具有低泡易清洗、不留白斑、无磷无氮、安全环保等特点。在全自动硅片超声清洗设备中,该清洗剂的最佳使用工艺为:清洗温度为55℃,清洗时间为240 s,清洗浓度为2.5%。

The preparation method and application performance of a solar silicon wafer cleaning agent TF-014 are introduced. The cleaning agent is suitable for the diamond wire cutting ultrasonic cleaning process. It not only has excellent degreasing and metal ion chelation capabilities, but also has low foam easy to clean, no white spots, no phosphorus and nitrogen, safety and environmental protection. In the automatic silicon wafer ultrasonic cleaning equipment, the best use process of the cleaning agent is: the cleaning temperature is 55 ℃, the cleaning time is 240 s, and the cleaning concentration is 2.5%.