薄壁材料厘米级阵列结构电解加工的数值模拟与实验验证

Numerical simulation and experimental verification of electrochemical machining of thin-walled materials with centimeter-scale array structure

为推进电解加工在薄壁材料厘米级阵列结构的工程应用,采用绝缘法对单孔直径为0.5 cm的5×5阵列孔结构进行了探索性研究。首先,基于传统电解法设计了针对5×5阵列孔结构的加工方案;在此基础上,对各加工方案下的流场和电场进行了仿真模拟;仿真发现:柱形式阵列阴极适合阵列孔结构的加工,且当电解液压力为0.5 MPa,初始加工间隙为0.5 cm,电压达到25 V时,可以实现金属材料的快速去除;最终,通过实验验证了阵列柱形掩模电极方案的可行性。

In order to promote the engineering application of electrochemical machining(ECM)in centimeter-scale array structure of thin-walled materials,this paper uses the insulation method to explore the 5×5 array hole structure with a single hole diameter of 0.5 cm.Firstly,based on the traditional ECM,a machining plan for the 5×5 array hole structure was designed;on this basis,the flow field and electric field under each machining scheme are simulated;the simulation shows that the cylindrical array cathode is suitable for the machining of the array hole structure,and when the electrolyte pressure is 0.5 MPa,the processing gap is 0.5 cm,and the voltage reaches 25 V,the metal material can be quickly removed;finally,the feasibility of the array cylindrical mask electrode solution is verified through experiments.