双还原剂体系在化学镀中的应用研究

Application of Double Reductant System in Electroless Plating

化学镀合金镀层的性能与合金组分密切相关,镀层中的非金属元素种类和含量对镀层特性有着巨大影响。介绍了多种还原剂复合使用的新型化学镀方法,实现了对镀层中非金属元素种类和含量的控制。通过配合使用次磷酸钠、DMAB、甲酸钠等不同还原剂进行Pd-P、Pd-P-B、Co-P-B等镀层的化学沉积,并对比不同还原剂配比条件下镀层中非金属元素含量。利用SEM、EDS、XPS对镀层形貌及其组成进行表征,结果表明:使用次磷酸钠、DMAB复配可以成功制备Co-P-B、Pd-P-B镀层,镀层中P、B元素的含量能够通过还原剂的选择和配比进行调控;在次磷酸化学镀镍液中采用甲酸钠复配,可以降低镍磷合金的磷含量。

The performance of electroless alloy coating is closely related to the alloy composition.The type and content of non-metallic elements in the coating have a great influence on the characteristics of the coating.This paper presents a new electroless plating method using a variety of reducing agents,which realizes the control of the types and contents of non-metallic elements in the coating.The electroless deposition of PD-P,Pd-P-B and Co-P-B coatings was carried out by using different reducing agents such as sodium hypophosphite,DMAB and sodium formate,and the contents of non-metallic elements in the coatings were compared under different reducing agent ratios.The morphology and composition of the coating were characterized by SEM,EDS and XPS.The results show that Pd-P-B and Co-P-B coatings can be successfully prepared by the combination of sodium hypophosphite and DMAB,and the contents of P and B elements in the coating can be controlled by the selection and ratio of reducing agent.Using sodium formate in hypophosphoric acid electroless Ni-P plating solution can reduce the phosphorus content of nickel phosphorus alloy.