国内外半导体用环氧塑封材料供需现状及预测

Analysis on worldwide and China’s supply and demand of epoxy molding compound

环氧塑封材料是半导体产品封装用的主要材料。简要介绍了环氧塑封材料的生产技术,综述了全球环氧塑封材料主要生产企业、供求现状及预测,从供应、进出口、需求和供需平衡等4个方面分析了国内环氧塑封材料供需现状和未来趋势,并给出了未来发展建议。

Epoxy molding compound(EMC)is the main material used in packaging semiconductor products.The production technology for EMC material was briefly introduced,and reviewed worldwide main EMC producers,supply/demand status and projection.From the aspects of production,import and export,consumption as well as balance between supply and demand,China’s status and future trend of EMC were analyzed and expected.In addition,corresponding suggestions were given for China’s EMC industry.