摘要
The morphology and orientation evolution of Cu_(6)Sn_(5)grains formed on(001)Cu and(011)Cu single crystal substrates under temperature gradient(TG)were investigated.The initial orientated prism-type Cu_(6)Sn_(5)grains transformed to non-orientated scallop-type after isothermal reflow.However,the Cu_(6)Sn_(5)grains with strong texture were revealed on cold end single crystal Cu substrates by imposing TG.The Cu_(6)Sn_(5)grains on(001)Cu grew along their c-axis parallel to the substrate and finally merged into one grain to form a fully IMC joint,while those on(011)Cu presented a strong texture and merged into a few dominant Cu_(6)Sn_(5)grains showing about 30°angle with the substrate.The merging between neighboring Cu_(6)Sn_(5)grain pair was attributed to the rapid grain growth and grain boundary migration.Accordingly,a model was put forward to describe the merging process.The different morphology and orientation evolutions of the Cu_(6)Sn_(5)grains on single crystal and polycrystal Cu substrates were revealed based on crystallographic relationship and Cu flux.The method for controlling the morphology and orientation of Cu_(6)Sn_(5)grains is really benefitial to solve the reliability problems caused by anisotropy in 3 D packaging.
基金
financially supported by the National Natural Science Foundation of China(Nos.52075072)
the Fundamental Research Funds for the Central Universities(No.DUT20JC46)。
