PCIe HBA控制器芯片封装基板设计与仿真

PCIe HBA controller chip package substrate design and simulation

针对PCIe HBA控制器芯片,采用倒装球栅格阵列(Flip Chip Ball Gate Array,FCBGA)封装形式,完成了PCIe4.0封装基板的设计与信号仿真,保证了16 Gb/s高速差分信号传输的信号完整性。PCIe差分信号优化前后仿真结果比较结果表明,以RX0信号为例,工作频率为16 GHz时,差分信号的回波损耗和插入损耗分别为-8.84 dB和-1.92 dB,分别提高了2.75 dB和1.17 dB;眼图的眼宽和眼高分别为155 mV和0.53 UI,提高了7 mV和0.01 UI,优化后的封装基板设计提升了信号的传输质量,保证了PCIe的信号完整性。

For the PCIe HBA controller chip,the Flip Chip Ball Gate Array(FCBGA)package form is used to complete the design and signal simulation of the PCIe4.0 package substrate,ensuring 16 Gb/s high-speed differential signal transmission signal integrity.Taking the RX0 signal as an example,the comparison of the simulation results before and after the PCIe differential signal optimization shows that,when the operating frequency is 16 GHz,the return loss and insertion loss of the differential signal are-8.84 dB and-1.92 dB,respectively,increased by 2.75 dB and 1.17 dB,respectively;the eye width and eye height of the eye diagram were 155 mV and 0.53 UI,which increased by 7 mV and 0.01 UI,respectively.The optimized package substrate design improved the signal transmission quality and ensured PCIe signal integrity.