Cr、Ce、P对Sn-0.7Cu无铅钎料高温抗氧化及铺展性能的影响

Effects of Cr,Ce and P on High Temperature Oxidation Resistance and Spreading Property of Sn-0.7Cu Lead-free Solder

研究了微量元素Cr、Ce、P对Sn-0.7Cu无铅钎料在400℃条件下的氧化出渣及铺展率的影响,通过扫描电镜(SEM)、俄歇电子能谱探究了钎料的表面氧化发生过程及机理,并将优化配比后的钎料与市场上商用高温抗氧化钎料的性能进行对比。结果表明:添加一定量的Cr、Ce、P均有助于提高钎料的高温抗氧化性能,Ce、P的加入能提高钎料的铺展率,但Cr元素的加入会降低钎料的铺展率。400℃条件下,添加的微量元素更容易在熔融钎料表面氧化聚集,使氧化膜结构更为致密,减少凸起颗粒,提高了钎料的抗氧化性能。当添加2.0‰的Cr、1.5‰的Ce、0.02‰的P时,钎料的综合性能较好,此时出渣降低率为31.4%,铺展率为80.3%。

The effects of trace elements Cr,Ce and P on the oxidative slag and spreading ratio of Sn-0.7 Cu lead-free solder at 400℃were investigated.The scanning electron microscopy(SEM)and Auger electron spectroscopy were used to investigate the oxidation process and mechanism on surface of the solder.The performance composition of the solder with the optimized ratio was compared with that of the commercially available solder.The results show that the addition of a certain amount of Cr,Ce and P can improve the oxidation resistance of the solder at high temperature.The spreading ratio of the solder increases when Ce and P are added,however,the addition of Cr will reduce the spreading ratio of the solder.The addition of trace elements are more likely to aggregate on the surface of the solder at 400℃,making the oxide film more dense,reducing the raised particles and improving the oxidation resistance of the solder.When 2.0‰Cr,1.5‰Ce and 0.02‰P are added,the comprehensive performance of the solder is the best,and the slag reduction rate is 31.4%and the spreading rate is 80.3%.