Ni掺杂对低铜钨复合材料性能的影响

Effect of Ni Doping on Properties of Low Cu-W Composites

为了研究掺杂活化元素Ni对低铜钨复合材料性能的影响,分别制备了掺杂不同Ni含量(0.3%、0.5%和0.75%)的低铜钨复合材料,并对其组织、密度、硬度以及抗拉强度(室温)进行了检测。研究表明:当Ni含量分别为0.3%和0.5%时,低铜钨复合材料组织均匀性较好;当Ni含量增加到0.75%时,钨相与铜相分布呈现不均匀现象;当Ni含量由0.3%增加到0.75%时,其密度、硬度以及抗拉强度分别从16.827 g/cm^(2)、224.0 HV30、685 MPa升至18.043 g/cm^(3)、312.6 HV30、733 MPa。

In order to study the influence of Ni doping on the properties of low Cu-W composites,the low Cu-W composites with different Ni contents(0.3%,0.5%and 0.75%)were prepared,and their structure,density,hardness and tensile strength(room temperature)were tested.The results show that when the Ni content is 0.3%and 0.5%,the microstructure uniformity of low Cu-W composites is better.When Ni content increases to 0.75%,the distribution of tungsten phase and copper phase is uneven.When Ni content increases from 0.3%to 0.75%,the density,hardness and tensile strength increase from 16.827 g/cm^(3),224.0 HV30 and 685 MPa to 18.043 g/cm^(3),312.6 HV30 and 733 MPa,respectively.